Solid State Disk (SSD) Products

Disk Drive Technology has been around for many years, but the state-of-the-art has progressed to the point now that many gigabytes of storage can be put into packages half the size of a postage stamp and weighing not much more. Micross Components has developed a family of SSD products, integrating high density FLASH memory, along with a FLASH memory controller that also handles the IDE disk drive interface. This packs quite a bit of very reliable storage capability into an extremely small space. These products exhibit several advantages over legacy rotating media. Advantages include low noise, extremely small size and low weight, high reliability, ruggedness and low power consumption.

These SSDs are offered as COTS solutions, in extended and industrial temperature range versions, including our microSSDs, which are packaged in a 14mm x 24mm x 1.3mm PBGA which is the smallest available in the industry. The resulting component weight is less than 1 gram! Many of the applications and markets these products serve have stringent requirements, including tolerance to harsh environments and for highly integrated component solutions, where size, power consumption, weight reduction, reliability and ruggedness are all primary concerns.

Military / Aerospace SSD Applications:
Micro UAVs
Future Combat Soldier
Heads-up Displays
Targeting Systems
Surveillance
Security Monitoring Devices
Man-portable Digital Radios
Industrial / Ruggedized PCs
Ruggedized Netbook / Mobile Computing
Automation Control
Test / Measurement
Medical Equipment

microSSD Products

microSSD: The Micross' COTS solution is based on multiple FLASH die and a IDE/FLASH Controller die integrated into an extremely small 91-ball PBGA package measuring only 14mm x 24mm x 1.3mm in size. This represents the smallest SSD in the industry. Hence, Micross Components has dubbed these devices "microSSDs". The microSSDs are available in 4G and 8GByte densities. Click here to view microSSD features.

SSD Products

SSD: Micross' iPem solution is an SSD based on embedded packaged (FLASH and IDE controller die) devices in multiple organic laminates and is manufactured using a proprietary stacking technology to create an extremely space conscious, robust Solid State Disk Sub-system. Packaging for this product is a 381-ball PBGA measuring 31mm x 31mm square, and is 5mm to 7.4mm high, depending on the density. This "direct board mount Solid State Disk" is capable of operating in harsh, vibration prone product platforms. This product is available in densities of 4G, 8G and 16GByte versions. Click here to view SSD features. SSD is not recommended for new designs. Contact Micross Marketing & Sales to discuss availability. The new microSSD is the recommended replacement part.

PRODUCT LINE

Click here to view our microSSD Solid State Disk (SSD) Product Line. (View/download datasheets)

PRODUCT FLYER

Click here to view our micro Solid State Disk (microSSD) Products Flyer.
Click here to view our Solid State Disk (SSD) Products Flyer.

PRESS RELEASE

Micross Components unveils a smaller, more compact 7.5 cm³ IDE ruggedized Solid State Disk (SSD).

microSSD FEATURES

Integrated NAND FLASH and FLASH/IDE controller
4G and 8GByte densities
91-ball PBGA package, measuring 14mm x 24mm x 1.3m
Weighs only 0.8 grams
3.3V Vcc operation
Extreme low power: 125mA active, 0.7mA sleep mode (typical)
Industry standard ATA/IDE bus interface, 8 or 16 bit access, supporting PIO/DMA Mode-6
Robust power down protection
Expanded data protection
Built-in ECC
Sustained Transfer rate: 12MB/s Write & 55MB/s Read
Host writes up to 7 million cycles endurance
Smart commands enabling indication of remaining product life
Sophisticated Wear Leveling
Extended Operating Temperature Range: -20°C to +85°C

SOLID STATE DISK FEATURES

Integrated NAND FLASH and Controller
4G, 8G or 16GByte densities
381-ball PBGA package, measuring 31mm x 31mm x 5mm to 7.4mm
3.3V or 5V Vcc operation
Extreme low power: 50ma active, 0.2mA sleep mode (typical)
(2) stacks, each containing (1, 2, or 4) NAND components
Each NAND component, either a 4,8 or 16Gb device, based on the use of single silicon and stacked silicon solutions
Controller contained in base interposer
Fast ATA host to buffer transfer rates supporting True IDE, PIO/4 mode support
512Byte Sector Buffers
Flash Memory power-down logic
ECC correction = 6 Bytes within a 512 Byte sector
Automatic Sleep Mode
Burst Transfer rate, 16.67MB per second
Sustained Transfer rate: 7.7MB/s for the 4 & 8GB densities, 5MB/s for the 16GB
Sophisticated Wear Leveling
Industrial Operating Temperature Range: -40°C to +85°C

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