products & services

Extensive Test & Burn-In Capabilities

Micross Components engineering staff is experienced and ready to service your electrical evaluation and device reliability testing needs, including infant mortality "burn-in" screening and upscreening of commercial plastic components. Micross has built a large foundation of test program libraries on a multitude of test platforms with base programs numbering in the thousands, and test hardware fi xtures for many hundreds of unique, ceramic and plastic packages and pin counts.

If you are looking for increased reliability assurance and your requirements entail burn-in, or life test, Micross Components has several large capacity ovens, especially suited for dynamic, or static bias excitation with already tooled burn-in boards for multitude of devices and packages.

TESTER CAPABILITY

  • Teradyne J997-100 ⁄ 200 MHz, 72 I ⁄ O's
  • 5 Teradyne J937-50 ⁄ 100 MHz, 36 I ⁄ O's
  • Credence Diamond D10
  • SZ M3000 - Multi-Family Test System
  • Sentry VII – 10MHz, 60 Pin High Speed Head, 60 Pin High Voltage Head
  • 2 Automated Bench Test Systems
  • LTX TS80 – Linear ⁄ Mixed Signal Test System
  • 2 Sentry 21 – 20MHz, 120 Pin High Speed Head, 60 Pin High Voltage Head
  • Testronics 201C – Discrete Component Test System
  • Sub-Nanosecond ECL Logic AC Test System
  • Automated Handlers
  • Large Variety of Standard Bench Test Equipment and High Precision Equipment

BURN-IN ⁄ LIFE TEST CAPABILITY

  • Dynamic ⁄ Static
  • Accelerated VCC
  • Arrhenius ⁄ FIT Rate Calculation
  • 100°C, 125°C, 135°C, 145°C
  • Logic, Linear, PLD, VLSI
  • All Memory Devices
  • Infant Mortality EFR
  • Functional Check In-Situation
  • PDA ⁄ Parameter Drift
  • Data Retention ⁄ Endurance
  • 5 Large-Capacity Memory Burn-In Ovens
  • 4 Custom Product Burn-In Ovens
  • 3 Auxiliary Custom Product Ovens

PRODUCT TESTING

Micross has experience in testing a wide range of both memory and logic ⁄ linear ⁄ VLSI products, and maintain a large library of test programs under strict quality control standards.

MEMORY ⁄ MEMORY MODULES

  • SRAM ⁄ SSRAM
  • DRAM ⁄ SDRAM
  • VRAM
  • EEPROM ⁄ FLASH

ELECTRICAL TEST

  • -65°C to +150°C
  • Group A
  • Correlation ⁄ Gold Standard
  • Modules
  • Attributes Data
  • Logic, Linear, PLD, VLSI
  • All Memory Devices
  • Precision High Speed
  • Low-Noise PWB Design
  • Discrete Components

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