COTS / iPEMS Products
Micross Components' long-term experience and knowledge in product engineering and test, and support of the Hi-Rel community, has lead to the development of our "COTS" (Commercial Off The Shelf) and our "iPEM" (integrated Plastic Encapsulated Microcircuit) device family.
Parts are tested to Industrial, Extended, and Military temperature ranges, with burn-in and temperature cycling available as requested. Reliability is ensured by levering off the OEM supplier's qualification as a complement to Micross' own qualification, based on 22+ years experience producing products to Military and other Hi-Rel specifications.
Micross provides this rigorous, value-added up-screening with the Hi-Reliability socket/platform in mind, yet meeting or exceeding the guidelines of the Perry Initiative.
- SDRAM
- SDR: 64Mb, 128Mb, 256Mb & 512Mb; 3.3V
Packaging: Copper & Alloy 42 lead frames, TSOPII-54
- iPEM SDR: 1.2Gb; 3.3V
Packaging: PBGA-219 (25mm x 32mm)
- DDR: 512Mb; 2.5V
Packaging: TSOPII-66
- MDDR (Mobile DDR): 1Gb; 1.8V
Packaging: PBGA-90
- iPEM DDR: 1.2Gb & 2.4Gb; 2.5V
Packaging: PBGA-219 (25mm x 32mm) & PBGA-208 (16mm x 23mm)
- iPEM DDR2: 2.1Gb, 2.4Gb, 4.1Gb and 4.8Gb; 1.8V
Packaging: PBGA-255 (25mm x 32mm) & PBGA-208 (16mm x 23mm)
- SSRAM
- 4Mb to 36Mb; 3.3V
Pipelined, Flow-Through and ZBL(No BL)
Packaging: TQFP-100
- SRAM (Asynchronous)
- 256Kb to 16Mb; 5V and 3.3V
Packaging: TSOJ & TSOP
- Non-Volatile
- FLASH: 1Mb, 16Mb, & 1GB; 3.3V
Packaging: TSOP-32, TSOP-48, & TSOP-56
- nvSRAM: 4Mb; 3.3V
Packaging: TSOP-44
- Solid State Disk (SSD)
- microSSD: ATA/IDE/PIO Mode-6, 4Gb & 8Gb; 3.3V
Packaging: PBGA-91 (14mm x 24mm x 1.3mm)
- iPEM SSD: PATA/ATA-5, 4Gb, 8Gb & 16Gb; 5V or 3.3V
Packaging: PBGA-381 (31mm x 31mm x 4.2 – 7.8mm)
COTS/iPEMS Design
Click Here For COTS/iPEMS Design Support.
LITERATURE
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